Products and Technology

FPC

FPC1

Product Application: Smart Handheld/SIM

FPC2

Application: Electric vehicle/Rear light strips

FPC3

Application: Camera /Rigid-Flex PCB

FPC4

Application: Smart Phone/Touch Pad

FPC5

Application:NB/PANEL TO MB (Dynamic Bend)

FPC6

Application: NB/Heating plate

FPC7

Application: Smart Phone/Zoom Lens 8 layers Rigid-Flex PCB

FPC8

Application: Smart Phone/MIC & SOR

FPC9

Application: NB/IO Connected Board

FPC10

Application: Lens/Rigid-Flex PCB

FPC

FPC Application

1.Static Flexible Circuit Board (often just called a “static flex”) is a type of flexible printed circuit (FPC) designed for applications where the flex circuit will be bent or folded only once or a few times during assembly, but not repeatedly during its service life.
2. Dynamic Flex Circuit (also called a flexible printed circuit for dynamic applications) is a type of flexible circuit designed to withstand continuous, repetitive motion during the product’s operational life.
3.Integrated Flex Circuit to Cable Assembly combines the benefits of flexible printed circuits (FPCs) with traditional wire or cable harnesses into a single interconnect solution. This hybrid design is used when certain parts of the system benefit from the precision, thin profile, and reliability of a flex circuit, while other areas require the ruggedness, strain relief, or long reach of standard cables.

Smart Handheld
Consumer Electronics
Automotive Electronics
Surgical Robotics
Display Electronics
Product Features
  • High Flexibility Design: Can bend, fold, and twist without damaging conductors, ideal for complex structures.
  • 3D Conformability: Can be installed on three-dimensional shapes and in confined spaces, overcoming the limitations of rigid boards.
  • Lightweight Advantage: Significantly lighter compared to rigid boards or wire harnesses.
  • Reduced Failure Risk: Fewer connectors and solder joints minimize mechanical interface issues, enhancing system reliability.
  • Vibration and Fatigue Resistance: Withstands long-term vibration and repeated bending while maintaining stable performance.
  • Optimized Electrical Performance: Shorter circuit paths reduce current resistance, ensuring high-speed signal quality.
  • High-Frequency Applications: Widely used in RF and high-speed mixed-signal designs.

Process overview

Process equipment
Sheer
Drill
Copper Plating
Exposuring
DES
AOI
Two Layer FPC Process
Alignment
Lamination Press
Copper Plating
Acid Dip(cleaning)
Surface Finished
Screen Printng
O_S Test
Punch
SMT
Assembly
Function Test
Inspection
回到頂端