Products and Technology

FPC

FPC1

Application: Electric vehicle/Sensor Package

FPC2

Application: Electric vehicle/Rear light strips

FPC3

Application: Camera /Rigid-Flex PCB

FPC4

Product Application: Smart Handheld/SIM

FPC5

Application: Smart Phone/Touch Pad

FPC6

Application: Electric vehicle/Charging Module

FPC7

Application:NB/PANEL TO MB (Dynamic Bend)

FPC8

Application: NB/Heating plate

FPC9

Application: Smart Phone/Zoom Lens 8 layers Rigid-Flex PCB

FPC10

Application: Smart Phone/MIC & SOR

FPC11

Application: NB/IO Connected Board

FPC12

Application: Lens/Rigid-Flex PCB

FPC

FPC Application

1.Static Flexible Circuit Board (often just called a “static flex”) is a type of flexible printed circuit (FPC) designed for applications where the flex circuit will be bent or folded only once or a few times during assembly, but not repeatedly during its service life.
2. Dynamic Flex Circuit (also called a flexible printed circuit for dynamic applications) is a type of flexible circuit designed to withstand continuous, repetitive motion during the product’s operational life.
3.Integrated Flex Circuit to Cable Assembly combines the benefits of flexible printed circuits (FPCs) with traditional wire or cable harnesses into a single interconnect solution. This hybrid design is used when certain parts of the system benefit from the precision, thin profile, and reliability of a flex circuit, while other areas require the ruggedness, strain relief, or long reach of standard cables.

Smart Handheld
Consumer Electronics
Automotive Electronics
Surgical Robotics
Display Electronics
Product Features
  • Can bend, fold, and twist without damaging the conductors.
  • Conforms to 3D shapes and compact spaces where rigid PCBs cannot fit.
  • Significantly reduces weight compared to rigid PCBs or wire harnesses.
  • Fewer connectors, solder joints, and mechanical interfaces → lower failure risk.
  • Excellent resistance to vibration and mechanical fatigue.
  • Shorter circuit paths improve signal quality by lowering resistance to current flow.
  • Suitable for RF, high-frequency, and mixed-signal applications.

Process overview

Process equipment
Sheer
Drill
Copper Plating
Exposuring
DES
AOI
Two Layer FPC Process
Alignment
Lamination Press
Copper Plating
Acid Dip(cleaning)
Surface Finished
Screen Printng
O_S Test
Punch
SMT
Assembly
Function Test
Inspection
回到頂端